Chau-Chyun Chen

  • Source: Scopus
  • Calculated based on no. of publications stored in Pure and citations from Scopus
1978 …2021

Research activity per year

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Network

Sheik Tanveer

  • Texas Tech University
  • TTU

External person

Lawrence B. Evans

  • Massachusetts Institute of Technology
  • Aspen Technology, Inc.

External person

Song, Yuhua

  • Aspen Technology, Inc.

External person

Soraya Honarparvar

  • Texas Tech University

External person

Nazir Hossain

  • Texas Tech University

External person

Yifan Hao

  • Texas Tech University

External person

Maximilian B. Gorensek

  • Savannah River National Laboratory

External person

Ashwin Ravichandran

  • Texas Tech University

External person

Hla Tun

  • Texas Tech University

External person

Md Rashedul Islam

  • Texas Tech University

External person

Sina Hassanjani Saravi

  • Texas Tech University

External person

Harnoor Kaur

  • Texas Tech University

External person

Samira Abedi

  • Texas Tech University

External person

Meng Wang

  • Texas Tech University

External person

Sanjoy K. Bhattacharia

  • Texas Tech University
  • Texas A&M University
  • West Texas A&M University

External person

Bokis, Costas P.

  • Aspen Technology, Inc.
  • Exxon Mobil Research and Engineering

External person

Meng Wang

  • Northwest Agriculture and Forestry University
  • Northeast Normal University

External person

Orbey, Hasan

  • Aspen Technology, Inc.

External person

Kevin C. Seavey

  • Virginia Polytechnic Institute and State University

External person

Y. A. Liu

  • Virginia Polytechnic Institute and State University

External person

Neeraj P. Khare

  • Virginia Polytechnic Institute and State University

External person

Sundaram Ramanathan

  • Aspen Technology, Inc.
  • AspenTech Limited

External person

Sina H Saravi

  • Texas Tech University

External person

Toni Kirkes

  • Texas Tech University

External person

Gary T. Rochelle

  • University of Texas at Austin
  • Aspen Technology, Inc.
  • AspenTech Limited

External person

Michael Sees

  • Texas Tech University

External person

Zong, Li

  • AspenTech Limited
  • Aspen Technology, Inc.

External person

Shu Wang

  • University of Delaware
  • Aspen Technology, Inc.

External person

David M. Austgen

  • University of Texas at Austin

External person

Joseph F. Boston

  • Massachusetts Institute of Technology
  • Aspen Technology, Inc.

External person

Yizu Zhu

  • Massachusetts Institute of Technology

External person

Mathias, Paul

  • Aspen Technology, Inc.

External person

Tremblay, D. A.

  • Aspen Technology, Inc.

External person

Yue Yu

  • Texas Tech University

External person

H. I. Britt

  • Aspen Technology, Inc.
  • Massachusetts Institute of Technology

External person

Jonathan King

  • Massachusetts Institute of Technology

External person

Yuan Li

  • Texas Tech University

External person

G. M. Bollas

  • Massachusetts Institute of Technology

External person

Que, Huiling

  • AspenTech Limited

External person

Yu Jeng Lin

  • Texas Tech University

External person

Zhang, Ying

  • AspenTech Limited

External person

Xiao Peng

  • University of Texas at Austin
  • SINOPEC

External person

Simon Lingard

  • Aspen Technology, Inc.

External person

Yan, Yizhuan

  • AspenTech Limited

External person

Yue Yu

  • Texas Tech University

External person

Benny D. Freeman

  • University of Texas at Austin

External person

Naureen S. Suteria

  • Texas Tech University

External person

Rajasi Shukre

  • Texas Tech University

External person

Barrera, M. D.

  • Aspen Technology, Inc.

External person

Stanley I. Sandler

  • University of Delaware

External person

P. I. Barton

  • Massachusetts Institute of Technology

External person

Bill Mock

  • Aspen Technology, Inc.
  • Massachusetts Institute of Technology

External person

Zhou, Huan

  • Tianjin University of Science & Technology

External person

Selim Anavi

  • Aspen Technology, Inc.

External person

I.-M. Hsieh

  • Texas Tech University

External person

Benjamin Caudle

  • Texas Tech University

External person

Ying Zhang

  • AspenTech Limited
  • Aspen Technology, Inc.
  • University of Texas at Austin

External person

Nguyen H. Nguyen

  • Texas Tech University

External person

Amit K. Thakur

  • Texas Tech University

External person

Thomas N. Williams

  • Honeywell International Inc.

External person

Bruce Lucas

  • Virginia Polytechnic Institute and State University

External person

Hern Chen

  • Aspen Technology, Inc.
  • AspenTech Limited
  • University of Texas at Austin

External person

Md Rafiul Islam

  • Texas Tech University

External person

Bosong Lin

  • Texas Tech University

External person

Brian Hanley

  • Aspen Technology, Inc.

External person

Osias, M. M.

  • Aspen Technology, Inc.

External person

Cheng Hsiu Yu

  • Texas Tech University

External person

Ko, G. H.

  • Aspen Technology, Inc.

External person

Michael Modell

  • Modell Development Corporation

External person

Peggy Evanich

  • National Aeronautics and Space Administration

External person

Jorge M. Plaza

  • Aspen Technology, Inc.
  • AspenTech Limited
  • University of Texas at Austin

External person

I. Min Hsieh

  • Texas Tech University

External person

Earl Schoenborn

  • Honeywell International Inc.

External person

Daniel I.C. Wang

  • Massachusetts Institute of Technology

External person

Mock, Theresa L.

  • Aspen Technology, Inc.

External person

Gochenour, Boyd

  • Aspen Technology, Inc.

External person

Luke D. Simoni

  • University of Notre Dame

External person

Y. A. Liu

  • Virginia Polytechnic Institute and State University

External person

Jeff Mai

  • Aspen Technology, Inc.

External person

Md R Islam

  • Texas Tech University

External person

Ginosar, Daniel M.

  • Savannah River National Laboratory

External person

Shiang Tai Lin

  • National Taiwan University

External person

Ehsan Sheikholeslamzadeh

  • Western University

External person

Ignasi Palou-Rivera

  • American Institute of Chemical Engineers

External person

Richard Oldland

  • Virginia Polytechnic Institute and State University

External person

Phipps, Donald L.

  • Aspen Technology, Inc.

External person

Aguda, Remil

  • University of the Philippines Los Banos

External person

Gabriele Sadowski

  • Technical University of Berlin
  • Dortmund University

External person

Chung-Kang Chang

  • National Taiwan University

External person

Roeb, Martin

  • German Aerospace Center

External person

J. C. Bruno

  • Universitat Rovira I Virgili

External person

Gorensek, Maximillian B

  • Savannah River National Laboratory

External person

Wong, Bunsen

  • Savannah River National Laboratory

External person

Oba, Shigeo

  • Aspen Technology, Inc.

External person

Joan F. Brennecke

  • University of Notre Dame

External person

Henley, David B

  • Savannah River National Laboratory

External person

John Mattson

  • Honeywell International Inc.

External person

Dziuk, Stephen

  • Aspen Technology, Inc.

External person

Sohrab Rohani

  • Western University

External person

Harry Hu

  • Honeywell International Inc.

External person

Benjamin Caudle

  • Savannah River National Laboratory

External person

Fisher, John

  • NOVA Chemicals Corporation

External person

Sina Hassanjani

  • Texas Tech University

External person

Lambert, David P

  • Savannah River National Laboratory

External person

Joseph K Scott

  • Georgia Institute of Technology

External person

Ross Dugas

  • Aspen Technology, Inc.
  • AspenTech Limited
  • University of Texas at Austin

External person

Rashedul Islam

  • Texas Tech University

External person

Mark A. Stadtherr

  • University of Notre Dame

External person

Chun Kai Chang

  • National Taiwan University

External person

Bremner, Tim

  • Aspen Technology, Inc.

External person

Taehun Kim

  • Georgia Institute of Technology

External person

John W. Weidner

  • University of South Carolina

External person

Sirohi, Ashuraj

  • Aspen Technology, Inc.

External person

David S.-H. Wong

  • National Tsing Hua University

External person

Joseph Scott

  • Georgia Institute of Technology

External person

Ye Yue

  • Texas Tech University

External person

Summers, William A.

  • Idaho National Laboratory

External person

Michael Zwolak

  • Virginia Polytechnic Institute and State University

External person

Charles Larkin

  • Honeywell International Inc.

External person

David Shan Hill Wong

  • National Tsing Hua University

External person

Monnier, John R.

  • General Atomics

External person

Zuo, Davy

  • AspenTech Limited

External person

Cheluget, Eric L.

  • NOVA Chemicals Corporation

External person

Cheng Hsiu Yu

  • Texas Tech University

External person

Benjamin H Caudle

  • Texas Tech University

External person

Eric Mullins

  • Virginia Polytechnic Institute and State University

External person

Dennis Thomey

  • Texas Tech University

External person

A. K. Thakur

  • Texas Tech University

External person

Greenbelt, Ronald A.

  • Aspen Technology, Inc.

External person

Margaret MacDonell

  • The University of Chicago
  • United States Department of Energy
  • Argonne National Laboratory

External person

Tom Lee

  • Virginia Polytechnic Institute and State University

External person

Wardhaugh, Leigh

  • NOVA Chemicals Corporation

External person

Meixell, Milo D.

  • Aspen Technology, Inc.

External person

Colon-Mercado, Hector R.

  • Savannah River National Laboratory

External person

Li, Hailang

  • Aspen Technology, Inc.

External person

Jason Pettrey

  • Virginia Polytechnic Institute and State University

External person

Boson Lin

  • Texas Tech University

External person

Novak, Lawrence T.

  • The Lubrizol Corporation

External person

Tissa H. Illangasekare

  • University of Colorado Boulder
  • Colorado School of Mines

External person

Brown, Lloyd C.

  • General Atomics

External person

Ni Yan

  • University of Texas at Austin

External person

Stefan Behme

  • Technical University of Berlin
  • Bayer AG

External person

Peng, Jianjun

  • Aspen Technology, Inc.

External person

Watanasiri, Suphat

  • Aspen Technology, Inc.

External person

Juan Carles Bruno

  • Universidad Rovira i Virgili

External person